A W-Band Corporate-Fed Hollow-Waveguide Slot Array Antenna by Glass Micromachining
A W-Band Corporate-Fed Hollow-Waveguide Slot Array Antenna by Glass Micromachining
复制标题
玻璃微加工 W 波段企业馈电空心波导缝隙阵列天线
DOI：
10.23919/isap47053.2021.9391384
复制
发表时间：
2021
期刊：
影响因子：
--
通讯作者：
Q. Liu
中科院分区：
文献类型：
--
作者：
Yaxiang Wu;Tian Yu;Miao Zhang;Daquan Yu;J. Hirokawa;Q. Liu
本文提出一种采用玻璃微加工技术的W波段16×16元共馈充气波导缝隙阵列天线。该天线由五层玻璃晶片层压而成。每层均采用玻璃通孔 (TGV) 技术创新制造。它采用激光诱导深蚀刻工艺实现，并已初步应用于先进封装领域。根据湿法刻蚀工艺，玻璃晶圆设计时考虑了10°的锥角。除了天线的电磁分析外，还对其机械和热特性进行仿真和分析，以确保玻璃晶圆键合的成功。实验结果表明，中心频率94 GHz处的天线增益为30.3 dBi，W频段天线增益高于30 dBi的带宽为13.3%。
This paper proposes a W-band 16×16-element corporate-fed air-filled waveguide slot array antenna by glass micromachining technology. This antenna is constructed by laminating five layers of glass wafers. Each layer is innovatively fabricated by through glass via (TGV) technology. It is realized by using a laser-induced deep etching process, and has been applied initially to the advanced packaging field. According to the wet-etching process, a taper angle of 10° is taken into account during the design of glass wafers. In addition to the antenna's electromagnetic analysis, its mechanical and thermal characteristics are also simulated and analyzed to ensure the success of glass wafer bonding. As the experimental results, the antenna gain of 30.3 dBi at the center frequency 94 GHz, and the bandwidth of 13.3% for the antenna gain higher than 30 dBi are achieved in the W-band.