Silicon Integrated Circuits

Silicon Integrated Circuits
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硅集成电路

DOI:
10.1109/iret-mil.1960.5008274
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发表时间:
1960
期刊:
IRE Transactions on Military Electronics
影响因子:
--
通讯作者:
W. Glendinning
W. Glendinning
中科院分区:
--
文献类型:
--
作者:
W. Glendinning

文献摘要

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讨论了利用半导体集成电路来减小军用电子系统的体积和重量。综述了获得微小型化水平的纯半导体集成电路方法,并对其进行了表征。本文介绍了一种硅集成微电路的设计和结构。给出了微电路电性能的检测结果,包括微电路热行为的检测结果。从内部和外部几何结构、材料特性和电性能方面分析了硅结构。
The use of semiconductor integrated circuitry to reduce size and weight of military electronic systems is discussed. The pure semiconductor integrated circuit approach used to obtain micro-microminiaturization levels is reviewed and characterized. Described in this paper are the design and construction of a silicon integrated microcircuit. Results of examination of the electrical performance of the microcircuit are presented, including results of examination of the thermal behavior of the microcircuit. The silicon structure is analyzed in terms of internal and external geometry, material properties, and electrical performance.