Multiscale assembly of solution-processed organic electronics: the critical roles of confinement, fluid flow, and interfaces
Multiscale assembly of solution-processed organic electronics: the critical roles of confinement, fluid flow, and interfaces
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DOI：
10.1088/1361-6528/aa9d7c
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发表时间：
2018-01
期刊：
影响因子：
3.5
通讯作者：
B. Patel;Ying Diao
中科院分区：
文献类型：
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作者：
B. Patel;Ying Diao
有机半导体小分子和聚合物为研究分子和分级组装的基础提供了丰富的相空间。由于分子间相互作用较弱，它们的组装敏感地取决于加工条件，这反过来又极大地调节了它们的电子特性。人们在分子设计策略方面开展了大量工作，以最大限度地提高分子间相互作用并鼓励紧密堆积。然而，人们不太了解的是在制造过程（特别是溶液涂覆和印刷）过程中发生的非平衡组装，这对于确定跨长度尺度的薄膜形态至关重要。这包括分子尺度的多态性和分子堆积、数十纳米尺度的π键聚集体的组装以及微米毫米器件尺度的域的形成。在这里，我们讨论了有机电子薄膜溶液加工中普遍存在的三种现象：限制效应、流体流动和界面组装以及它们在引导组装中发挥的作用。本综述重点关注对装配结果如何与解决方案处理环境紧密结合的机械理解，并得到最近文献中突出示例的支持。
Organic semiconducting small molecules and polymers provide a rich phase space for investigating the fundamentals of molecular and hierarchical assembly. Stemming from weak intermolecular interactions, their assembly sensitively depends on processing conditions, which in turn drastically modulate their electronic properties. Much work has gone into molecular design strategies that maximize intermolecular interactions and encourage close packing. Less understood, however, is the non-equilibrium assembly that occurs during the fabrication process (especially solution coating and printing) which is critical to determining thin film morphology across length scales. This encompasses polymorphism and molecular packing at molecular scale, assembly of π-bonding aggregates at the tens of nanometers scale, and the formation of domains at the micron-millimeter device scale. Here, we discuss three phenomena ubiquitous in solution processing of organic electronic thin films: the confinement effect, fluid flows, and interfacial assembly and the role they play in directing assembly. This review focuses on the mechanistic understanding of how assembly outcomes couple closely to the solution processing environment, supported by salient examples from the recent literature.