Effects of Size and Number Density of Micro-reentrant Cavities on Boiling Heat Transfer from a Silicon Chip Immersed in Degassed and Gas-dissolved FC-72
Effects of Size and Number Density of Micro-reentrant Cavities on Boiling Heat Transfer from a Silicon Chip Immersed in Degassed and Gas-dissolved FC-72
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DOI：
10.1615/jenhheattransf.v6.i2-4.80
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发表时间：
1999
影响因子：
2.3
通讯作者：
H. Kubo;H. Takamatsu;H. Honda
中科院分区：
文献类型：
--
作者：
H. Kubo;H. Takamatsu;H. Honda
