Progress in extreme ultraviolet interferometric lithography at the University of Wisconsin
Progress in extreme ultraviolet interferometric lithography at the University of Wisconsin
复制标题
威斯康星大学在极紫外干涉光刻方面取得进展
DOI:
10.1117/12.772681
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发表时间:
2008
期刊:
影响因子:
--
通讯作者:
F. Cerrina
中科院分区:
文献类型:
--
作者:
A. Isoyan;Yang;F. Jiang;J. Wallace;M. Efremov;P. Nealey;F. Cerrina
Extreme Ultraviolet Interferometric lithography (EUV-IL) can generate periodic patterns useful to characterize photoresist materials and to create templates for self-assembled geometries. The Center for NanoTechnology has developed a novel EUV-IL beamline dedicated to nanopatterning using radiation from an undulator on the Aladdin storage ring at the University of Wisconsin-Madison. The beamline and the EUV-IL system were commissioned in 2006; we have completed several characterization studies, and modified several key components to improve resolution and usability. The EUV-IL system can expose different pitches at the same time producing patterns with a range of halfpitch from 55nm down to 20nm and less on the wafer. We can also introduce a variable image modulation by performing double exposures, overlapping the interference pattern with the transmitted zero order. Recently we have demonstrated down to 20nm half-pitch printed IL image in PMMA resist.