The first is entitled “ PDN Design Strategies : II . Ceramic SMT Decoupling Capacitors – Does Location Matter ? ”

The first is entitled “ PDN Design Strategies : II . Ceramic SMT Decoupling Capacitors – Does Location Matter ? ”
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第一篇的标题是“PDN 设计策略:II 陶瓷 SMT 去耦电容器 – 位置重要吗?”

DOI:
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发表时间:
2006
期刊:
影响因子:
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通讯作者:
J. Drewniak
J. Drewniak
中科院分区:
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文献类型:
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作者:
R. Olsen;J. Knighten;B. Archambeault;Jun Fan;G. Selli;Liang Xue;S. Connor;J. Drewniak

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在本期中,您将找到EMC社区成员应该感兴趣的三篇实用文章。第一个是题为“PDN设计策略:二。陶瓷SMT去耦电容器-位置重要吗?”詹姆斯L。Eughten,布鲁斯Archambeault,Jun Fan,Giuseppe Selli,Liang Xue,Samuel康纳,和James L.德鲁尼亚克这是他们正在撰写的一系列论文中的第二篇。如果你喜欢2005年秋季出版的第一篇论文(我怀疑你确实喜欢),你也会喜欢这篇。正如我上次提到的,数字系统的速度正在提高,电源去耦的主题比以往任何时候都更加重要。第二篇论文的题目是“Electromagnetic Near-Field Scanning for Microelectronic Test Chip Investigation”,作者是Adam Tankielun、Uwe Keller、Etienne Sicard、Peter Kravenek和Bertrand Vrignon。本文讨论了CMOS测试芯片电源网络中片上去耦电容对辐射噪声的影响。这是对本节第一篇论文的一个很好的补充。第三篇论文的标题是“验证计算电磁建模技术的选定方法”,作者是Andy Drozd。用Andy的话说,“计算电磁学和计算机技术验证是目前非常热门的话题,不仅在EMC协会圈子内,而且在其他地方和其他EM联盟内。我同意并坚信,使用数字技术而不考虑其有效性可能会导致严重的问题。本文首次在2005年于芝加哥举行的IEEE EMC国际研讨会上发表,经研讨会委员会许可,本文转载。本节的目的是向EMC社区传播实用信息。在某些情况下,材料完全是原创的。在另一些国家,这些材料不是新的,但已使社区更容易理解或更容易获得。在另一些国家,这些材料以前曾在一次会议上介绍过,但被认为特别值得更广泛地传播。希望与EMC社区中的同事分享此类信息的读者,可以为《新闻稿》的这一部分提交论文或应用说明。我的电子邮件、传真和真实的邮件地址见第3页。虽然所有材料在接受之前都将经过审查,但标准与交易文件的标准不同。具体而言,虽然文件不一定要存档,但文件必须对《通讯》的读者有用和感兴趣。欢迎读者对这些论文提出意见,可以写信(或电子邮件)给技术编辑,也可以直接给作者。
In this issue you will find three practical papers that should be of interest to members of the EMC community. The first is entitled “PDN Design Strategies: II. Ceramic SMT Decoupling Capacitors – Does Location Matter?” by James L. Knighten, Bruce Archambeault, Jun Fan, Giuseppe Selli, Liang Xue, Samuel Connor, and James L. Drewniak. This is the second in a series of papers they are writing. If you enjoyed the first paper published in the Fall 2005 issue (and I suspect that you did), you will enjoy this one. As I noted last time, the speed of digital systems is increasing and the subject of power supply decoupling is more relevant than ever. The second paper is entitled, “Electromagnetic Near-Field Scanning for Microelectronic Test Chip Investigation” by Adam Tankielun, Uwe Keller, Etienne Sicard, Peter Kralicek and Bertrand Vrignon. In this paper the authors discuss the effects of on-chip decoupling capacitors in the power supply network of a CMOS test-chip on radiated noise. It is a nice complement to the first paper in this section. The third paper is entitled, “Selected Methods for Validating Computational Electromagnetic Modeling Techniques,” by Andy Drozd. In Andy’s words, “Computational electromagnetics and computer technique validation is a very hot topic at the moment, not just within the EMC Society circles, but elsewhere and within other EM consortia.” I agree and believe strongly that the use of numerical techniques without a concern for their validity can lead to serious problems. This paper was first presented at the 2005 IEEE International Symposium on EMC in Chicago and has been reprinted here by permission of the Symposium Committee. The purpose of this section is to disseminate practical information to the EMC community. In some cases the material is entirely original. In others, the material is not new but has been made either more understandable or accessible to the community. In others, the material has been previously presented at a conference but has been deemed especially worthy of wider dissemination. Readers wishing to share such information with colleagues in the EMC community are encouraged to submit papers or application notes for this section of the Newsletter. See page 3 for my e-mail, FAX and real mail address. While all material will be reviewed prior to acceptance, the criteria are different from those of Transactions papers. Specifically, while it is not necessary that the paper be archival, it is necessary that the paper be useful and of interest to readers of the Newsletter. Comments from readers concerning these papers are welcome, either as a letter (or e-mail) to the Technical Editor or directly to the authors.