Fabrication of three-dimensional microstructures by electrochemically welding structures formed by microcontact printing on planar and curved substrates
Fabrication of three-dimensional microstructures by electrochemically welding structures formed by microcontact printing on planar and curved substrates
复制标题
DOI：
10.1109/84.679396
复制
发表时间：
1998-06-01
影响因子：
2.7
通讯作者：
Whitesides, GM
中科院分区：
文献类型：
--
作者：
Jackman, RJ;Brittain, ST;Whitesides, GM
本文介绍了两种方便的技术制造的三维（3-D）结构与微米尺寸的功能。该方法使用微接触印刷（μ CP）在平面基底和圆柱体（直径类似于2 mm）上限定具有小至20 μ m的特征尺寸的图案。电沉积用作用于金属沉积和焊接的微米级工具，其将这些图案化的表面和圆柱体转变成金属复杂的3-D微结构（例如，四面体）。最终的四面体（类似于2厘米的边）具有小至50微米的特征尺寸。
This paper describes two convenient techniques for the fabrication of three-dimensional (3-D) structures with micron-sized features. The methods use microcontact printing (mu CP) to define patterns with feature sizes as small as 20 mu m both on planar substrates and on cylinders (diameter similar to 2 mm), Electrodeposition serves as a micron-scale tool for metal deposition and welding that transforms these patterned surfaces and cylinders into metallic complex 3-D microstructures (e.g., tetrahedra). Final tetrahedra (similar to 2-cm sides) have feature sizes as small as 50 mu m.