Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current
Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current
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DOI：
10.1007/s11664-014-3377-x
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发表时间：
2014-09
影响因子：
2.1
通讯作者：
Youngseok Kim;S. Nagao;T. Sugahara;K. Suganuma;M. Ueshima;H. Albrecht;K. Wilke;J. Strogies
中科院分区：
文献类型：
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作者：
Youngseok Kim;S. Nagao;T. Sugahara;K. Suganuma;M. Ueshima;H. Albrecht;K. Wilke;J. Strogies
