Impact of few electron phenomena on floating-gate memory reliability

Impact of few electron phenomena on floating-gate memory reliability
复制标题

少电子现象对浮栅存储器可靠性的影响

DOI:
10.1109/iedm.2004.1419320
复制
发表时间:
2004
期刊:
IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004.
影响因子:
--
通讯作者:
S. Deleonibus
S. Deleonibus
中科院分区:
--
文献类型:
--
作者:
Gabriel Molas;D. Deleruyelle;B. D. Salvo;Gérard Ghibaudo;M. Gely;S. Jacob;D. Lafond;S. Deleonibus

文献摘要

被引文献

相似文献

在本文中,我们给出了一个定量评估的浮动栅(FG)的存储器在十纳米范围内,由于减少集体现象和单电子随机行为的主导地位的内在可靠性限制。提出了一个新的模型,定量预测的存储器保持时间和编程窗口的本征分散。在超大规模的存储器设备(下降到30纳米/SPL倍/30纳米),无论是连续的多晶硅或硅-双晶FG上获得的实验结果,也被提出。最后,推断未来几代闪存的固有可靠性限制。
In this paper we give a quantitative evaluation of the intrinsic reliability limits of floating gate (FG) memories in the deca-nanometer range, due to the reduction of collective phenomena and to the dominance of single electron stochastic behaviours. A new model that quantitatively predicts the intrinsic dispersions of the memory retention time and programming window is proposed. Experimental results obtained on ultra-scaled memory devices (down to 30nm /spl times/ 30nm), with either continuous poly-Si or Si-nanocrystal FG, are also presented. Finally, extrapolations on the intrinsic reliability limits of future generations of Flash memories are done.