Hydrogen blister formation and cracking behavior for various tungsten materials
Hydrogen blister formation and cracking behavior for various tungsten materials
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DOI：
10.1016/j.jnucmat.2004.10.077
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发表时间：
2005-03
影响因子：
3.1
通讯作者：
Y. Ueda;T. Funabiki;T. Shimada;K. Fukumoto;H. Kurishita;M. Nishikawa
中科院分区：
文献类型：
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作者：
Y. Ueda;T. Funabiki;T. Shimada;K. Fukumoto;H. Kurishita;M. Nishikawa
为了研究纯W， k掺杂W和la2o3掺杂W的氢起泡和随后的开裂行为，在653K下辐照1keV H3+（主要离子成分）离子束，影响高达1×1025H/m2。进行了两次辐照前热处理以消除应力（900°C）和再结晶（1300°C纯W和1500°C k掺杂和la2o3掺杂W）。研究发现，气泡特性和裂纹行为与微观结构和掺杂材料密切相关。对于层状组织的W材料，水泡形状多为球形，而对于再结晶（或无序）组织的W材料，水泡形状复杂，呈高原状，并有许多裂纹。K或la2o3掺杂剂的加入增加了应力解除和再结晶W的水泡和剥落的数量。
In order to study hydrogen blistering and subsequent cracking behavior of pure W, K-doped W, and La2O3-doped W, 1keV H3+(main ion components) ion beams were irradiated at 653K to fluences up to 1×1025H/m2. Two pre-irradiation heat treatments were done for stress relief (900°C) and recrystallization (1300°C for pure W and 1500°C for K-doped and La2O3-doped W). It was found that blister characteristics and cracking behavior strongly depended on microstructures and dopant materials. For W materials with layered microstructure, blister shapes were mostly spherical-like, while for W materials with recrystallized (or disordered) microstructures, blisters had complicated plateau-like shapes with many cracks. Addition of K or La2O3dopants increased the number of blisters and exfoliations for both stress relieved and recrystallized W.