Fracture behavior of Cu-cored solder joints
Fracture behavior of Cu-cored solder joints
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DOI：
10.1007/s10853-011-5654-x
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发表时间：
2011-06
影响因子：
4.5
通讯作者：
Yunsung Kim;Hyelim Choi;Hyo-Byeang Lee;Dongjun Shin;Jeong-Geun Moon;H. Choe
中科院分区：
文献类型：
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作者：
Yunsung Kim;Hyelim Choi;Hyo-Byeang Lee;Dongjun Shin;Jeong-Geun Moon;H. Choe
铜芯焊料由于其在极端热条件下的优异可持续性，可被视为暴露于苛刻操作条件的微电子半导体的下一代焊料，用于运输系统的微电子半导体。具有两种不同涂层Sn-3.0Ag和Sn-1.0In的Cu芯焊点与基线Sn-3.0Ag-0.5Cu焊料进行了比较。断裂强度和失效模式进行了研究，使用高速球拉和正常速度剪切试验。具有Sn-1.0In镀层的Cu芯焊点表现出最高的球拉强度和剪切强度。此外，由于Cu芯和Sn-1.0In镀层之间的润湿性改善，Cu芯和镀层之间的界面断裂百分比比Sn-3.0Ag镀层中的界面断裂百分比低得多。
Copper-cored solder can be regarded as the next-generation solder for microelectronic semiconductors exposed to harsh operating conditions owing to its excellent sustainability under extreme thermal conditions, e.g., in microelectronic semiconductors used in transportation systems. Cu-cored solder joints with two different coating layers, Sn–3.0Ag and Sn–1.0In, were compared with the baseline Sn–3.0Ag–0.5Cu solder. The fracture strength and failure mode were examined using the high-speed ball-pull and normal-speed shear tests. The Cu-cored solder joint with the Sn–1.0In plating layer exhibited the highest ball-pull and shear strengths. In addition, it showed a much lower percentage of interface fracture between the Cu-core and plating layer than the interface fracture percentage in the Sn–3.0Ag plating layer due to the improved wettability between the Cu-core and Sn–1.0In plating layer.