Ultrafast multi-layer subtractive patterning.
Ultrafast multi-layer subtractive patterning.
复制标题
超快多层减法图案化。
DOI:
10.1364/oe.26.011928
复制
发表时间:
2018
期刊:
影响因子:
3.8
通讯作者:
B. Mills
中科院分区:
文献类型:
--
作者:
Daniel J. Heath;T. H. Rana;Rupert. A. Bapty;J. Grant;Yunhui Xie;R. Eason;B. Mills
Subtractive femtosecond laser machining using multiple pulses with different spatial intensity profiles centred on the same position on a sample has been used to fabricate surface relief structuring. A digital micromirror device was used as an intensity spatial light modulator, with a fixed position relative to the sample, to ensure optimal alignment between successive masks. Up to 50 distinct layers, 335 nm lateral spatial resolution and 2.6 µm maximum depth structures were produced. The lateral dimensions of the structures are approximately 40 µm. Surface relief structuring is shown to match intended depth profiles in a nickel substrate, and highly repeatable stitching of identical features in close proximity is also demonstrated.