Organic Package Substrates Using Lithographic Via Technology for RF to THz Applications
Organic Package Substrates Using Lithographic Via Technology for RF to THz Applications
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使用光刻通孔技术进行射频至太赫兹应用的有机封装基板
DOI：
10.1109/iedm13553.2020.9372088
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发表时间：
2020
期刊：
影响因子：
--
通讯作者：
R. Han
中科院分区：
文献类型：
--
作者：
A. Aleksov;G. Dogiamis;T. Kamgaing;A. Elsherbini;J. Swan;K. Darmawikarta;S. Boyapati;J. Holloway;R. Han
RF基板封装使用有机介电层与铜（Cu）基互连来构建，该互连采用光刻限定的通孔作为半加成工艺流程的新制造范例。通过光刻过孔结合先进的有机内置电介质材料实现的基于封装的RF到THz结构使我们能够演示从同轴和共面波导、高Q RF电感器和变压器到滤波器、三工器和发射器结构的各种应用，用于1 GHz至> 300 GHz频率范围内的RF应用。本文介绍并讨论了所选结构的测量结果。
RF substrate packages were built using organic dielectric layers with Copper (Cu) based interconnects employing lithographically defined vias as a new manufacturing paradigm for a semi-additive process flow. The package-based RF-to-THz structures enabled by lithographic vias in combination with advanced organic build-up dielectric materials have enabled us to demonstrate applications ranging from coaxial and coplanar waveguides, high-Q RF inductors and transformers to filters, triplexers and launcher structures for RF applications in the frequency range from 1 GHz to > 300 GHz. Measurement results for selected structures are presented and discussed in this paper.