Polymer-Ceramic Nanocomposites Based on New Concepts for Embedded Capacitor
Polymer-Ceramic Nanocomposites Based on New Concepts for Embedded Capacitor
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DOI：
10.1541/ieejfms.126.1160
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发表时间：
2006-07
影响因子：
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通讯作者：
A. Takahashi;M. Kakimoto;T. Tsurumi;J. Hao;L. Li;R. Kikuchi;T. Miwa;T. Ohno;S. Yamada
中科院分区：
文献类型：
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作者：
A. Takahashi;M. Kakimoto;T. Tsurumi;J. Hao;L. Li;R. Kikuchi;T. Miwa;T. Ohno;S. Yamada
混合信号集成电路的快速发展推动了电子应用中元件的多功能和小型化需求。聚合物-陶瓷复合材料作为嵌入式电容器材料一直备受关注，因为它们使公司能够将聚合物的可加工性与陶瓷的高介电常数结合起来。基于新概念的聚合物-陶瓷纳米复合材料被开发用于嵌入式电容器。在1 MHz时介电常数大于80，比电容达到8 nF/cm2。利用这种纳米复合材料，制作了嵌入无源元件的多层印刷线路板原型。本文报道了以下技术。首先，在对氧化钛钡（BaTiO3）晶体进行研究的基础上，以草酸钛钡（BaTiO(C2O4)2·4H2O）为原料，采用两步热分解法制备了17 ~ 100 nm大小的颗粒。通过对BaTiO3悬浮液介电常数的有限元分析，明确了粒径在70 nm左右的BaTiO3颗粒的最大介电常数大于15000。其次，应用基于新概念的BaTiO3表面改性提高了BaTiO3颗粒与聚合物基体的亲和力。第三，从衬底的可加工性和集成大规模集成电路芯片的热稳定性两方面考虑，采用芳香族聚酰胺（PA）和芳香族双马来酰亚胺（BMI）共混聚合物作为基体。最后，将这些技术结合起来，并对嵌入式电容器材料进行了优化。
A rapid growth of mixed-signal integrated circuits is driving the needs of multifunction and miniaturization of the component in electronics applications. Polymer-ceramic composites have been of great interest as embedded capacitor materials because they enabled companies to combine the processability of polymers with the high dielectric constant of ceramics. Polymer-ceramic nanocomposites based on new concepts were developed for embedded capacitor applications. The dielectric constant was above 80 at 1 MHz and the specific capacitance was successfully achieved 8 nF/cm2. By use of this nanocomposites, multilayer printed wiring boards with embedded passive components were fabricated for prototypes. The following technologies are reported in this paper. Firstly, based on the investigation of barium titanium oxide (BaTiO3) crystallites, various particles with the sizes from 17 nm to 100 nm were prepared by the 2-step thermal decomposition method from barium titanyl oxalate (BaTiO(C2O4)2·4H2O). It was clarified that BaTiO3 particles with a size of around 70 nm exhibited a maximum dielectric constant of over 15,000 by FEM analysis from the measured dielectric constants of BaTiO3 suspensions. Secondary, the BaTiO3 surface modification based on a new concept was applied to improve the affinity between BaTiO3 particles and polymer matrix. Thirdly, the blend polymer of an aromatic polyamide (PA) and an aromatic bismaleimide (BMI) was employed as the matrix from a view-point of both the processabilty during fabricating the substrates with embedded passive components and the thermal stability during assembling LSI chips. Finally, these technologies were combined and optimized for embedded capacitor materials.