A Monolithic Force Sensing Integrated Flexure Bonder Dedicated to Flip-Chip Active Soft-Landing Interconnection
A Monolithic Force Sensing Integrated Flexure Bonder Dedicated to Flip-Chip Active Soft-Landing Interconnection
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DOI：
10.1109/tmech.2020.3019431
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发表时间：
2021-02
期刊：
影响因子：
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通讯作者：
Hui Tang;Sifeng He;Zhongyuan Zhu;Jian Gao;Lanyu Zhang;C. Cui;Xin Chen
中科院分区：
文献类型：
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作者：
Hui Tang;Sifeng He;Zhongyuan Zhu;Jian Gao;Lanyu Zhang;C. Cui;Xin Chen
倒装芯片键合系统对力传感和控制功能都有很高的要求，以确保高质量的芯片互连。本文的动机是联合收割机的能力，使一个共同的倒装芯片键合系统运行的方式，主动软着陆（ASL）互连。所开发的柔性键合机通过设计集成应变片传感和压电致动功能的挠曲力传感和控制机构来实现这些功能。首先，设计，建模和优化的柔性机构。进行了理论分析，包括力传感与控制工作原理论证、力-应变模型推导和动力学响应建模。此外，针对高动态工况下的高灵敏力控制问题，采用多目标遗传优化算法对机构进行了优化设计。然后，该柔性键合机构进行了分析和评价的有限元分析。最后，一系列的验证实验，包括力传感校准和性能测试，开环和闭环力控制测试，ASL测试，和实际的键合测试，成功地实施。结果表明，在400 N加载范围内，系统的工作精度可达1 N，在6000 N/s加载速度下，ASL超调量小于2 N。所有的结果一致证实，建议键合系统可以实现精确的力控制和满意的芯片互连性能与建议ASL键合策略。
A flip-chip bonding system has a high demand for both force sensing and control functions to ensure the high-quality chip interconnection. The motivation of this article is to combine the ability to enable a common flip-chip bonding system to run in the manner of active soft-landing (ASL) interconnection. The developed flexure bonder achieves these functions by designing a flexure force sensing and control mechanism integrated with strain gauge sensing and piezoelectric actuating functions. First, the design, modeling, and optimization of the flexure mechanism are presented. Theoretical analyses, including force sensing and control working principle demonstration, force–strain model derivation, and dynamics response modeling, are carried out. Besides, aiming at highly sensitive force control under high-dynamic working condition, the mechanism is optimized by the multiobjective genetic optimization algorithm. Then, this flexure bonder mechanism is analyzed and evaluated by finite-element analysis. Finally, a series of validation experiments, including force sensing calibration and performance tests, open- and closed-loop force controlling tests, ASL tests, and actual bonding tests, are successfully implemented. The results indicate that the operation accuracy of the developed system is improved up to $\pm$1 N under 400-N range, and the overshoot of ASL is less than 2 N under 6000-N/s loading speed. All the results uniformly confirm that the proposed bonding system can achieve precise force control and satisfactory chip interconnection performance with the proposed ASL bonding strategy.