Electrodeposition of Ni, Sn and Ni–Sn Alloy Coatings from Pyrophosphate-Glycine Bath
Electrodeposition of Ni, Sn and Ni–Sn Alloy Coatings from Pyrophosphate-Glycine Bath
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DOI：
10.1149/2.042205jes
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发表时间：
2012
影响因子：
3.9
通讯作者：
U. Lačnjevac;B. Jović;V. Jović
中科院分区：
文献类型：
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作者：
U. Lačnjevac;B. Jović;V. Jović
本文采用循环伏安法（CV）、恒电位脉冲法和极化曲线法，研究了在含焦磷酸盐和/或甘氨酸的溶液中电沉积Ni、Sn和Ni - Sn合金的过程。研究表明，在纯焦磷酸盐溶液中，锡电沉积过程始于约−0.90 V的电位，其特征是形成孤立的3D晶体，并通过还原[Sn(Pyr)2]6−络合物进一步生长。在GC表面，Sn三维晶体保持孤立，遵循三维成核和生长机制，这与任何理论预测模型都不符合。在含有阳离子（Sn2+, Ni2+）和阴离子（焦磷酸盐和甘氨酸）的溶液中，Ni - Sn合金的沉积与纯Sn沉积的生长机制相同，在pH 8.0下，同时还原[Sn(Pyr)2]6−,[Ni(Pyr)2]6−和/或[Ni(Pyr)3]−络合物。根据沉积在Ni电极上的Ni - Sn合金镀层的电流密度/电势的不同，扁平和致密镀层的组成在66 - 50原子% Ni，即34 - 50原子% Sn的范围内变化。
In this work the electrodeposition of Ni, Sn and Ni–Sn alloy from the solution containing pyrophosphate and/or glycine has been investigated by cyclic voltammmetry (CV), potentiostatic pulse and polarization curve measurements on two substrates, Ni and GC. It has been shown that the process of Sn electrodeposition in pure pyrophosphate solution commences at the potential of about −0.90 V on both substrates being characterized by the formation of isolated 3D crystals and their further growth by the reduction of [Sn(Pyr)2]6− complex. On the GC surface Sn 3D crystals remain isolated, following 3D nucleation and growth mechanism which does not fit any of the theoretically predicted models. Ni–Sn alloy deposition in the solution containing both cations (Sn2+, Ni2+) and both anions (pyrophosphate and glycine) occurs by the same growth mechanism as pure Sn deposition by simultaneous reduction of [Sn(Pyr)2]6−, [Ni(Pyr)2]6−and/or [Ni(Pyr)3]− complexes at pH 8.0. Depending on the current density/potential of the Ni–Sn alloy coating deposition onto Ni electrode the composition of the flat and compact coatings varies in the range from 66 to 50 atom% Ni, i.e. 34 to 50 atom% Sn.