The effect of thermal contact resistance on heat management in the electronic packaging
The effect of thermal contact resistance on heat management in the electronic packaging
复制标题
DOI：
10.1016/j.apsusc.2004.11.030
复制
发表时间：
2005-06-15
影响因子：
6.7
通讯作者：
Dusel, EC
中科院分区：
文献类型：
--
作者：
Grujicic, M;Zhao, CL;Dusel, EC
为了研究接触热阻对简单的中央处理器/散热器组件热管理的作用，进行了有限元分析。一个特别注意的是支付在评估的表面粗糙度特性，机械和热性能的接触机构，施加接触压力和使用热界面材料上的CPU经历的最高温度的影响。两类热界面材料：（a）相变材料和（B）丙烯酸或有机硅为基础的磁带。结果清楚地表明，微接触的塑性变形（由高接触压力和较低的显微硬度水平促进）和使用消除（高热阻）微间隙的热界面材料可以显着降低整体CPU/散热器的热接触电阻，促进热管理。它还表明，粗糙的微接触和良好的润湿性的配合表面的热界面材料的保留是至关重要的，以实现有效地去除由CPU产生的热量。(c)2004 Elsevier B. V.保留所有权利。
A finite element analysis is carried out in order to investigate the role of thermal contact resistance on heat management within a simple central processing unit (CPU)/heat sink assembly. A special attention is paid in assessing the effect of surface roughness characteristics, mechanical and thermal properties of the contacting bodies, applied contact pressures and the use of thermal interface materials on the maximum temperature experienced by the CPU. Two classes of thermal interface materials: (a) phase-change materials and (b) acrylic- or silicone-based tapes are considered. The results clearly reveal that plastic deformation of micro-contacts (promoted by high contact pressures and lower micro-hardness levels) and the use of thermal interface materials which eliminate (high thermal resistance) micro-gaps can significantly lower the overall CPU/heat sink thermal contact resistance and facilitate heat management. It is also shown that the retention of asperity micro-contacts and good wetting of the mating surfaces by the thermal interface material are critical for achieving an effective removal of the heat generated by the CPU. (c) 2004 Elsevier B.V. All rights reserved.