New Process of Self-Organized Interconnection in Packaging Using Conductive Adhesive with Low Melting Point Filler
New Process of Self-Organized Interconnection in Packaging Using Conductive Adhesive with Low Melting Point Filler
复制标题
低熔点填充导电胶封装自组织互连新工艺
DOI：
10.1143/jjap.43.2277
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发表时间：
2004
影响因子：
1.5
通讯作者：
K. Fujimoto
中科院分区：
文献类型：
--
作者：
K. Yasuda;Jongmin Kim;M. Yasuda;K. Fujimoto
模型实验证明，使用低熔点合金导电粘合剂的新型自组织连接工艺突破了电子封装中使用的传统焊料和粘合剂的限制。研究了粘合剂浆料的基本性能、接头形态、导电路径的形成和自组织特性。熔融填料在没有氧还原能力的树脂中以其初始球形形式保存，尽管在氧还原聚合物的情况下合金域发生扩大。通过改变树脂性能和工艺参数（例如接头的间隙距离和填料的体积分数）可以精确地控制传导路径的形成。在铜线图案玻璃环氧树脂基板上观察到由于熔化合金的毛细润湿而产生的自组织。表面基底上的一对线通过合金接头选择性地互连。
A model experiment of the novel self-organized joining process using conductive adhesive with low melting point alloy was demonstrated to break through the limitation of conventional solders and adhesives used in electronics packaging. Basic properties of the adhesive paste, joint morphology, the formation of the conduction path, and the self-organization characteristics were examined. Melting fillers were preserved in their initial spherical form in resin without oxygen-reduction capability, although enlargement of the alloy domain occurred in the case of oxygen-reduction polymer. The formation of the conduction path could be controlled accurately by varying the resin performance and the process parameters such as the gap distance of the joint and the volume fraction of filler. Self-organization due to capillary wetting of melting alloy was observed on the copper-line-patterned glass-epoxy substrate. The pair of lines on the faced substrates was selectively interconnected with an alloy joint.