Stress relaxation in plastic molding compounds
Stress relaxation in plastic molding compounds
复制标题
塑料模塑料中的应力松弛
DOI：
10.1109/emap.2002.1188810
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发表时间：
2002
期刊：
影响因子：
--
通讯作者：
S. Lee
中科院分区：
文献类型：
--
作者：
Xingjia Huang;S. Lee
用于塑料封装模塑料的粘弹性材料总是对施加的恒定应变表现出随时间变化的应力响应，这称为应力松弛。使用用于封装微电路的模塑料进行应力松弛测试，以测量应力和应变之间作为温度和施加应变的函数的时间相关的非线性本构关系。为了改进设计过程，可以使用使用短时应力松弛测试的方法来提供长时间的设计信息。本研究的目的是表征微电子器件在其生命周期中可能经历的环境条件下封装模塑料的非线性粘弹性行为，以帮助开发新的设计，包括材料选择和工艺，并告知有必要考虑固化收缩和粘弹性的影响：更好地估计器件中的应力和变形（例如翘曲）的行为。
Viscoelastic materials for plastic encapsulated molding compounds invariably exhibit a time-dependent stress response to an imposed constant strain, which is called stress relaxation. Stress relaxation tests with molding compounds used to encapsulate microcircuits have been performed to measure the time dependent non-linear constitutive relation between stress and strain as a function of temperature and imposed strain. In an effort to improve the design process, a methodology using short time stress relaxation tests can be used to provide long-time design information. The goal of this study is to characterize the non-linear viscoelastic behavior of the encapsulated molding compound during environmental conditions that microelectronics devices have possibly experienced in their lifetime in order to help in developing new design including material selection and process and to inform that it is necessary to include the effect of curing shrinkage as well as viscoelastic: behavior for better estimation for stress and deformation such as warpage in device.