Preparation and pool boiling characteristics of copper nanofluids over a flat plate heater
Preparation and pool boiling characteristics of copper nanofluids over a flat plate heater
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DOI:
10.1016/j.ijheatmasstransfer.2010.01.022
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发表时间:
2010-04
影响因子:
5.2
通讯作者:
R. Kathiravan;Ravi Kumar;Akhilesh Gupta;R. Chandra
中科院分区:
文献类型:
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作者:
R. Kathiravan;Ravi Kumar;Akhilesh Gupta;R. Chandra
The copper nanoparticles of average size of 10nm have been prepared by the sputtering method and characterized through atomic force microscopy (AFM), X-ray diffraction (XRD) and transmission electron microscopy (TEM). The pool boiling heat transfer characteristics of 0.25%, 0.5% and 1.0% by weight concentrations of copper nanoparticles has been studied. Different copper based nanofluids were prepared in both, distilled water and distilled water with 9.0wt% of sodium lauryl sulphate anionic surfactant (SDS). The pool boiling heat transfer data were acquired for the boiling of nanofluids over a 30mm square and 0.44mm thick stainless steel plate heater. The experimental results show that for the critical heat flux of pure water is 80% higher than that of water–surfactant fluid. Also, it was found that the critical heat flux for 0.25%, 0.5% and 1.0% concentrations of copper nanoparticles in copper–water nanofluids are 25%, 40% and 48% higher than that of pure water. But in the case of copper–water with surfactant nanofluids comparing with pure water, the CHF decreases to 75%, 68%, and 62% for respective concentrations of copper nanoparticles. The heat transfer coefficient decreases with increase of nanoparticles concentration in both water–copper and water–copper with surfactant nanofluids.