Preparation and pool boiling characteristics of copper nanofluids over a flat plate heater

Preparation and pool boiling characteristics of copper nanofluids over a flat plate heater
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DOI:
10.1016/j.ijheatmasstransfer.2010.01.022
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发表时间:
2010-04
影响因子:
5.2
通讯作者:
R. Kathiravan;Ravi Kumar;Akhilesh Gupta;R. Chandra
R. Kathiravan;Ravi Kumar;Akhilesh Gupta;R. Chandra
中科院分区:
工程技术2区
文献类型:
--
作者:
R. Kathiravan;Ravi Kumar;Akhilesh Gupta;R. Chandra

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采用溅射法制备了平均粒径为10 nm的铜纳米粒子,并通过原子力显微镜(AFM)、X射线衍射(XRD)和透射电子显微镜(TEM)对其进行了表征。研究了纳米铜颗粒质量分数为0.25%、0.5%和1.0%时的池沸腾传热特性。在蒸馏水和添加9.0wt%十二烷基硫酸钠阴离子表面活性剂(SDS)的蒸馏水中制备了不同的铜基纳米流体。在30 mm见方、0.44mm厚的不锈钢加热板上,对纳米流体的池沸腾换热进行了实验研究。实验结果表明,纯水的临界热流密度比水-表面活性剂流体高80%。此外,它被发现,在0.25%,0.5%和1.0%浓度的铜纳米粒子的铜-水纳米流体的临界热流密度是25%,40%和48%,高于纯水。但在铜-水与表面活性剂纳米流体的情况下,与纯水相比,CHF降低到75%,68%,和62%的相应浓度的铜纳米粒子。在水-铜和含表面活性剂的水-铜纳米流体中,随着纳米颗粒浓度的增加,传热系数降低。
The copper nanoparticles of average size of 10nm have been prepared by the sputtering method and characterized through atomic force microscopy (AFM), X-ray diffraction (XRD) and transmission electron microscopy (TEM). The pool boiling heat transfer characteristics of 0.25%, 0.5% and 1.0% by weight concentrations of copper nanoparticles has been studied. Different copper based nanofluids were prepared in both, distilled water and distilled water with 9.0wt% of sodium lauryl sulphate anionic surfactant (SDS). The pool boiling heat transfer data were acquired for the boiling of nanofluids over a 30mm square and 0.44mm thick stainless steel plate heater. The experimental results show that for the critical heat flux of pure water is 80% higher than that of water–surfactant fluid. Also, it was found that the critical heat flux for 0.25%, 0.5% and 1.0% concentrations of copper nanoparticles in copper–water nanofluids are 25%, 40% and 48% higher than that of pure water. But in the case of copper–water with surfactant nanofluids comparing with pure water, the CHF decreases to 75%, 68%, and 62% for respective concentrations of copper nanoparticles. The heat transfer coefficient decreases with increase of nanoparticles concentration in both water–copper and water–copper with surfactant nanofluids.