MODELING , MEASUREMENT , AND STANDARDS FOR WAFER INSPECTION

MODELING , MEASUREMENT , AND STANDARDS FOR WAFER INSPECTION
复制标题

晶圆检测的建模、测量和标准

DOI：
--
复制
发表时间：
2003
期刊：
--
影响因子：
--
通讯作者：
T. Germer
T. Germer
中科院分区：
--
文献类型：
--
作者：
G. Mulholland;T. Germer

文献摘要

被引文献

相似文献

介绍了有关表面扫描检测系统 (SSIS) 校准的主要技术问题，包括对 SSIS 的显着特征和使用差分迁移率分析仪的沉积系统的描述。讨论了 NIST SRM 1963 (100 nm) 作为校准标准的作用。审查了 NIST 帮助 SEMI SSIS 工作组运行的循环实验的数据。介绍了新标准的主要特点。此外，还描述了 The Scatter Works 和 NIST 在通过光散射进行精确粒度测定方面取得的最新进展。
The major technical issues regarding the calibration of Surface Scanning Inspection Systems (SSIS) are presented including descriptions of the salient features of SSISs and the deposition system using the differential mobility analyzer. The role of the NIST SRM 1963 (100 nm) as a calibration standard is discussed. Data from round robin experiments, which NIST has helped the SEMI SSIS Task Force run, are reviewed. The major features of the new standards is presented. In addition, recent advances made at The Scatter Works and NIST in regard to accurate particle sizing by light scattering are described.