Structural, microstructural and corrosion properties of brush plated copper–tin alloy coatings
Structural, microstructural and corrosion properties of brush plated copper–tin alloy coatings
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DOI：
10.1016/j.surfcoat.2006.01.042
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发表时间：
2006-10
影响因子：
5.4
通讯作者：
B. Subramanian;S. Mohan;S. Jayakrishnan
中科院分区：
文献类型：
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作者：
B. Subramanian;S. Mohan;S. Jayakrishnan
采用X射线衍射仪、扫描电子显微镜和原子力显微镜对电刷镀低碳钢表面的铜锡合金镀层进行了研究。X射线衍射分析表明，电刷镀铜锡合金为非均质相，由六方相η-Cu6Sn5、正交相ε-Cu3Sn、四方相β-Sn3和立方铜相组成。扫描电子显微镜和原子力显微镜观察到衬底表面均匀的颗粒状复盖物。用原子吸收光谱仪(AAS)测定了合金成分。通过盐水浸泡和电化学腐蚀试验，评价了低碳钢表面电刷镀铜锡合金的防腐性能。结果表明，该合金系统具有较高的电荷转移电阻和很低的ICor值，而与衬底和低碳钢衬底上的单个元素相比，ICor值很低。
Cu–Sn alloy coatings on mild steel substrates produced by the brush plating process have been investigated using XRD, SEM and AFM. X-ray diffraction analysis revealed that the brush plated Cu–Sn alloy was heterogeneous and composed of hexagonal η-Cu6Sn5, orthorhombic ε-Cu3Sn, tetragonal β-Sn and cubic Cu phases. Uniform surface coverage of the substrate by granular morphology was observed from SEM and AFM. The alloy composition was determined from atomic absorption spectroscopy (AAS). The corrosion protection performance of brush plated Cu–Sn alloy on mild steel has been assessed using salt water immersion and electrochemical corrosion tests. The results indicated a high charge transfer resistance and very low ICorrfor the alloy system comparing with that of individual elements on the substrate and the mild steel substrate.