In-Hole Diodes for on-Chip Thermal Sensing
In-Hole Diodes for on-Chip Thermal Sensing
复制标题
用于片上热传感的孔内二极管
DOI：
10.1109/edtm47692.2020.9118033
复制
发表时间：
2020
期刊：
影响因子：
--
通讯作者：
Rongren Liang
中科院分区：
文献类型：
--
作者：
Cheng Li;Qi Chen;Mengfu Di;Zijin Pan;Albert Z. H. Wang;Huaqiang Wu;Tao Zhong;Jun Xu;Rongren Liang
自加热是集成电路的一个主要问题，特别是对于在先进技术节点上制造的复杂芯片。实时和精确的全芯片热映射对于实现先进IC的芯片级动态热管理至关重要，这是任何现有的管芯内热感测技术都无法实现的。本文报道了一种新颖的孔内PN二极管热传感器的概念，它，理想情况下，可以嵌入在每个晶体管的下面，监测单个晶体管的温度在真实的时间与高空间分辨率。经硅验证，新的孔内二极管传感器可用于为整个芯片构建大型热传感器网格，以实现晶体管级热传感分辨率，但不消耗额外的硅面积。
Self-heating is a major problem to ICs, particularly for complex chips made at advanced technology nodes. Real-time and precision full-chip thermal mapping is essential to realizing chip-scale dynamic thermal management for advanced ICs, which cannot be facilitated by any existing in-die thermal sensing techniques. This paper reports a novel in-hole PN diode thermal sensor concept, which, ideally, can be embedded underneath each transistor, to monitor the temperature of individual transistor in real time with high spatial resolution. Validated in silicon, the new in-hole diode sensors can be used to construct large thermal sensor mesh for the whole chip to achieve transistor-level thermal sensing resolution, however, consuming no extra Si area.