Crack opening model for unidirectional ceramic matrix composites at elevated temperature
Crack opening model for unidirectional ceramic matrix composites at elevated temperature
复制标题
单向陶瓷基复合材料高温裂纹扩展模型
DOI:
10.1016/j.ceramint.2018.06.172
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发表时间:
2018-10
影响因子:
5.2
通讯作者:
F. Jia
中科院分区:
文献类型:
--
作者:
C.-P. Yang;F. Jia
Crack opening displacement (COD) is a key parameter determining the gas diffusion regime and the associated oxidation kinetics of ceramic matrix composites (CMCs) in high temperature oxidative atmosphere. In this paper, COD of an isolated tunneling crack in unidirectional CMCs is formulated based on shear-lag theory. The model simultaneously considers the coupling effects of applied stress, environmental temperature and interface degradation. Both the elastic constants of the constituents and the interface slipping stress are regarded as temperature-dependent parameters. And, interface recession length was introduced to quantify oxidation effect on crack opening behavior of CMCs. Reasonability of the model was validated by comparing the predictions with experimental data of single tow SiC/BN/SiC composites. Besides, parametric analysis was performed with C/SiC composites, revealing that tension stress contributes to open matrix crack, while temperature acts the opposite. But, temperature effect on crack healing is weakened by interfacial friction. With aggravated interface oxidation, matrix crack closure can hardly be achieved for new interface debonding generates, resulting in linear increase of crack opening.
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DOI:
10.1016/j.compositesb.2013.06.026
发表时间:
2013-07
期刊:
--
影响因子:
--
作者:
G. Jefferson;Y. Gowayed;G. Ojard;E. Prevost;U. Santhosh
通讯作者:
G. Jefferson;Y. Gowayed;G. Ojard;E. Prevost;U. Santhosh
DOI:
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发表时间:
2006-11
影响因子:
8.7
作者:
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通讯作者:
M. Ruggles‐Wrenn;S. Mall;C. A. Eber;L. Harlan
影响因子:
3.5
作者:
Chengpeng Yang;G. Jiao;Bozhe Wang
通讯作者:
Chengpeng Yang;G. Jiao;Bozhe Wang
影响因子:
8.4
作者:
Chengyu Zhang;Xuanwei Wang;Yongsheng Liu;Bo Wang;D. Han;S. Qiao;Yong Guo
通讯作者:
Chengyu Zhang;Xuanwei Wang;Yongsheng Liu;Bo Wang;D. Han;S. Qiao;Yong Guo
DOI:
10.1111/j.1151-2916.1995.tb08046.x
发表时间:
1995-10-01
影响因子:
3.9
作者:
VAGAGGINI, E;DOMERGUE, JM;EVANS, AG
通讯作者:
EVANS, AG