Development and characterisation of novel anti-bacterial S-phase based coatings
Development and characterisation of novel anti-bacterial S-phase based coatings
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DOI：
10.1016/j.tsf.2017.10.054
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发表时间：
2017-12-31
期刊：
影响因子：
2.1
通讯作者：
Dong, Hanshan
中科院分区：
文献类型：
--
作者：
Formosa, Dennis;Li, Xiaoying;Dong, Hanshan
众所周知，具有生物活性的Ag/Cu离子是强杀菌剂，并且银或铜纳米颗粒已用于聚合物基抗菌涂料中。然而，它们差的耐久性限制了它们在摩擦学应用中的使用。这个问题已经在很大程度上解决最近通过开发新的等离子体共合金化的奥氏体不锈钢表面与氮和Ag/Cu形成耐磨抗菌S相。本研究首次采用磁控溅射法在奥氏体不锈钢表面共沉积Ag/Cu，制备了Ag、Cu掺杂的单层和多层硬质S相抗菌涂层。这些涂层使用多种技术，如SEM，TEM，XRD，GDOES和抗菌测试进行了充分表征。已经发现，可以产生具有显著抗菌功效的致密的Ag和Cu掺杂的S相层。这是在保持S相微结构的有利性质的同时实现的。与流行的基于扩散的S相生产（如等离子渗氮）相反，该技术还可应用于各种表面，包括低成本钢表面、聚合物和陶瓷。
It is well-known that biologically active Ag/Cu ions are strong bactericides and silver or copper nanoparticles have been used in polymer-based antibacterial coatings. However, their poor durability has limited their use in tribological applications. This problem has been largely addressed recently by developing novel plasma co-alloying of austenitic stainless steel surfaces with both nitrogen and Ag/Cu to form wear resistant antibacterial Sphase. However, this technology is only applicable to austenitic stainless steel as the S-phase cannot be formed to other materials.In this study, S-phase based anti-bacterial coatings have been, for the first time, developed using magnetron sputtering through co-deposition of austenitic stainless steel with Ag/Cu to form hard S-phase doped with Ag, Cu or both in monolayer and multilayer structures. These coatings were fully characterised using multiple techniques such as SEM, TEM, XRD, GDOES and anti-bacterial tests. It has been found that it is possible to produce dense Ag and Cu doped S-phase layer with significant anti-bacterial efficacy. This was achieved while preserving the advantageous properties of the S-phase microstructure. As opposed to the popular diffusion based S-phase production such as plasma nitriding, this technology can also be applied on all kinds of surfaces, including low-cost steel surfaces, polymers and ceramics.