Stress in Al-Sc Interconnection Layers
Stress in Al-Sc Interconnection Layers
复制标题
Al-Sc 互连层中的应力
DOI：
10.1143/jjap.32.l1394
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发表时间：
1993
影响因子：
1.5
通讯作者：
Tadao Ueda
中科院分区：
文献类型：
--
作者：
T. Hara;N. Hosoda;Shozo Nagano;Tadao Ueda
测量了不同Sc组分的Al-Sc层的应力。450℃烧结后的室温应力随Sc含量的增加而减小，当Sc含量为0.3%时，室温应力达到62 Mpa。这一应力水平远低于Al-1%Si-0.5%Cu层的327 Mpa。Al-0.15%Sc层的平均失效时间为6.3×106h。这一时间比Al-1%Si-0.5%Cu层的时间长7倍。因此，Al-Sc作为四分之一微米器件的互连层具有广阔的应用前景。
Stress has been measured in Al-Sc layers with different Sc compositions. Stress at room temperature after sintering at 450°C decreases with the increase of Sc concentration and reaches 62 MPa at Sc concentration of 0.3%. This stress level is much lower than of 327 MPa in the Al-1%Si-0.5%Cu layer. The mean time of failure is 6.3×106 h in an Al-0.15%Sc layer. This time is seven times longer than that in the Al-1%Si-0.5%Cu layer. Therefore, Al-Sc is a promising prospect as an interconnection layer for quarter-micron devices.