Li-intercalation into hexagonal boron nitride
Li-intercalation into hexagonal boron nitride
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DOI：
10.1016/j.jpcs.2009.12.038
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发表时间：
2010-04
影响因子：
4
通讯作者：
A. Sumiyoshi;H. Hyodo;K. Kimura
中科院分区：
文献类型：
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作者：
A. Sumiyoshi;H. Hyodo;K. Kimura
在1523K温度下，采用粉末或块状hBN和Li的退火方法，成功合成了Li- hbnic插层化合物。XRD分析发现，在较低角度插入li的情况下，BN层间距离扩大的强峰比hBN（002）小。样品的层间距离和膨胀率分别为3.76Å和12.6%，与第一期锂石墨插层化合物（Li-GIC） LiC6相似。在室温下，样品的电导率提高了几个数量级，从10−15到10−7Ω−1cm−1cm。通过样品在纯化水中的分散证实了Li脱嵌。
A Li hexagonal boron nitride (hBN) intercalation compound (Li-hBNIC) was successfully synthesized by the annealing of powder or bulk hBN and Li at 1523K. By an XRD analysis, a strong peak indicating the expansion of BN interlayer distance due to Li-intercalation was observed at an angle lower than that of hBN (002). In the sample, the interlayer distance and its expansion ratio were 3.76Å and 12.6%, respectively, and these values were similar to those of a first stage Li-graphite intercalation compound (Li-GIC), LiC6. The electrical conductivity of the sample was increased by several orders of magnitude, from 10−15to 10−7Ω−1cm−1at room temperature. Li de-intercalation was confirmed by the dispersion of the sample in purified water.