Effect of fixture compliance on thermally enhanced edge registration in microlamination

Effect of fixture compliance on thermally enhanced edge registration in microlamination
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DOI:
10.1115/1.1811112
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发表时间:
2004-11-01
影响因子:
4
通讯作者:
Paul, BK
Paul, BK
中科院分区:
工程技术3区
文献类型:
--
作者:
Wattanutchariya, W;Paul, BK

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微层叠涉及到被称为薄片的材料薄层的图案、配准和粘合,以产生高度平行的、空间强化的微通道系统,用于大量处理质量和能量。本文提出了一种热增强边缘配准(TEER)技术,用于在扩散键合过程中,利用层板与键合夹具之间的热膨胀差对准大量层板。然而,促进无屈曲TEER粘合所需的夹具公差非常小(低于10 μ m)。本研究的重点是开发一种基于夹具顺应性的热配准新方法,以允许更宽松的夹具公差。对柔性TEER夹具的屈曲特性和柔度进行了分析,研究了柔性TEER夹具的公差极限。通过实验对理论模型进行了验证。结果表明,一个柔性夹具可以允许一个可接受的公差限制在TEER。
Microlamination involves the patterning, registration, and bonding of thin layers of material, called laminae, to produce highly paralleled, spatially intensified microchannel systems for the bulk processing of mass and energy. A Thermally Enhanced Edge Registration (TEER) technique has been developed for precision aligning large numbers of laminae in diffusion-bonding processes based on the differential thermal expansion between the laminae and bonding fixture. However fixture tolerances necessary to promote buckle-free TEER bonding have been found to be very small (below 10 mum). This research focuses on the development of a new approach to thermal registration based on fixture compliance to permit looser fixture tolerances. An analysis based on both fin-buckling behavior and the compliance of the fixture is implemented to investigate the tolerance limit of a compliant TEER fixture. Experiments are conducted to verify the theoretical model. Results show that a compliant fixture can permit an acceptable tolerance limit in TEER.