Effect of fixture compliance on thermally enhanced edge registration in microlamination
Effect of fixture compliance on thermally enhanced edge registration in microlamination
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DOI:
10.1115/1.1811112
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发表时间:
2004-11-01
影响因子:
4
通讯作者:
Paul, BK
中科院分区:
文献类型:
--
作者:
Wattanutchariya, W;Paul, BK
Microlamination involves the patterning, registration, and bonding of thin layers of material, called laminae, to produce highly paralleled, spatially intensified microchannel systems for the bulk processing of mass and energy. A Thermally Enhanced Edge Registration (TEER) technique has been developed for precision aligning large numbers of laminae in diffusion-bonding processes based on the differential thermal expansion between the laminae and bonding fixture. However fixture tolerances necessary to promote buckle-free TEER bonding have been found to be very small (below 10 mum). This research focuses on the development of a new approach to thermal registration based on fixture compliance to permit looser fixture tolerances. An analysis based on both fin-buckling behavior and the compliance of the fixture is implemented to investigate the tolerance limit of a compliant TEER fixture. Experiments are conducted to verify the theoretical model. Results show that a compliant fixture can permit an acceptable tolerance limit in TEER.