Electrodeposition of copper on aligned multi-walled carbon nanotubes
Electrodeposition of copper on aligned multi-walled carbon nanotubes
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DOI：
10.1179/1743294411y.0000000095
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发表时间：
2012-07
影响因子：
2.8
通讯作者：
M. Schneider;M. Weiser;S. Dörfler;H. Althues;S. Kaskel;A. Michaelis
中科院分区：
文献类型：
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作者：
M. Schneider;M. Weiser;S. Dörfler;H. Althues;S. Kaskel;A. Michaelis
在这项工作中，铜的电化学沉积在对齐的多壁碳纳米管（MWCNTs）的水溶液电解质进行了描述。十二烷基硫酸钠的加入已被应用于增强疏水性MWCNT表面的润湿性。将MWCNT-铜复合膜从镍基材转移到胶带上，如用于碳纳米管合成的化学气相沉积工艺所应用的。此外，制备了由铜顶层和掺入铜的MWCNT中间层组成的夹层。所得的多壁碳纳米管和铜的复合材料的结构，其特征在于通过扫描电子显微镜。采用循环伏安法对碳纳米管在镍箔和导电碳带上的电化学行为进行了研究。
In this work, the electrochemical deposition of copper on aligned multi-walled carbon nanotubes (MWCNTs) from an aqueous electrolyte is described. The addition of sodium dodecyl sulphate has been applied to enhance wettability of the hydrophobic MWCNT surface. The transfer of the MWCNT–copper composite film from nickel substrates, as applied for the chemical vapour deposition process for carbon nanotube synthesis, onto adhesive tapes is performed. Moreover, a sandwich layer consisting of copper top layers and copper incorporated MWCNT interlayer was produced. The structure of the resulting composite material of MWCNTs and copper was characterised by scanning electron microscopy. An electrochemical investigation of the MWCNTs on nickel foil and on conductive carbon ribbon by cyclic voltammetry is presented.