Electrostatic control of dewetting dynamics
Electrostatic control of dewetting dynamics
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DOI：
10.1063/5.0010443
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发表时间：
2020-06-22
影响因子：
4
通讯作者：
Mchale, Glen
中科院分区：
文献类型：
--
作者：
Edwards, Andrew M. J.;Ledesma-Aguilar, Rodrigo;Mchale, Glen
表面液膜的稳定性在微尺度图案化和半导体工业中至关重要。如果薄膜足够薄，它可能会自发地从表面反湿。去湿的时间尺度和速率取决于表面的薄膜排斥性和液体的性质。因此，控制排斥性需要改变表面化学和液体特性以获得所需的薄膜收缩率。在这里，我们报告了如何通过非接触静电方法对表面排斥性进行编程来控制后退的细液带到球冠液滴的动力学。我们观察到，对于各种电压选择的最终接触角，动力学的预期缩放之间存在极好的一致性。我们的结果提供了一种以高精度和与印刷和定向模板相关的局部性控制去湿动态的方法。
The stability of liquid films on surfaces is critically important in microscale patterning and the semiconductor industry. If the film is sufficiently thin, it may spontaneously dewet from the surface. The timescale and rate of dewetting depend on the film repellency of the surface and the properties of the liquid. Therefore, control over the repellency requires modifying surface chemistry and liquid properties to obtain the desired rate of film retraction. Here, we report how the dynamics of a receding thin liquid stripe to a spherical cap droplet can be controlled by programming surface repellency through a non-contact electrostatic method. We observe excellent agreement between the expected scaling of the dynamics for a wide range of voltage-selected final contact angles. Our results provide a method of controlling the dynamics of dewetting with high precision and locality relevant to printing and directed templating.