Femtosecond Bessel-beam-assisted high-aspect-ratio microgroove fabrication in fused silica
Femtosecond Bessel-beam-assisted high-aspect-ratio microgroove fabrication in fused silica
复制标题
飞秒贝塞尔光束辅助熔融石英高深宽比微槽制造
DOI：
10.3788/col201513.041405
复制
发表时间：
2015-04
影响因子：
3.5
通讯作者：
Xiaowei Li
中科院分区：
文献类型：
--
作者：
Yongfeng Lu;Weiwei Zhao;Jun Xie;Xiaowei Li
报道了一种在二氧化硅中制备高纵横比（HAR）高质量微沟槽的简单、可重复的方法。该方法包括两个步骤：(1)利用飞秒贝塞尔光束照射形成激光修饰区；(2)通过HF蚀刻去除激光修饰区。可以制作均匀、直的微槽，最高宽高比可达~52。这种现象归因于长传播距离内能量分布均匀，导致长而均匀的激光修饰区和随后高选择性的HF酸蚀刻激光修饰区。该方法在透明材料中制备HAR微槽具有潜在的应用前景。
A simple and repeatable method to fabricate high-aspect-ratio (HAR) and high-quality microgrooves in silica is reported. The method consists of two steps: (1) formation of laser-modified regions by femtosecond Bessel beam irradiation, and (2) removing laser-modified regions through HF etching. Uniform, straight microgrooves can be fabricated and the highest aspect ratio that can be reached is ～52. The phenomenon is attributed to the uniform energy distribution in the long propagation distance, which leads to the long and uniform laser-modified regions and subsequent HF acid etching of laser-modified regions with high selectivity. This method will have potential applications in fabrication of HAR microgrooves in transparent materials.