Resonant terahertz transmissions through metal hole array on silicon substrate
Resonant terahertz transmissions through metal hole array on silicon substrate
复制标题
DOI：
10.1364/oe.18.018558
复制
发表时间：
2010-08-30
期刊：
影响因子：
3.8
通讯作者：
Sheng, Ping
中科院分区：
文献类型：
--
作者：
Xiao, Xiao;Jinbo, Wu;Sheng, Ping
我们已经观察到共振太赫兹透射峰的样品包括穿孔周期性孔阵列的金属薄膜，覆盖有高介电基板。这些谐振传输是由介质基片中的波导模式和金属薄膜中的周期孔阵列之间的相互作用引起的。时域有限差分（FDTD）模拟显示出良好的协议与数据，在支持所提出的机制。使用导模诱导额外的谐振传输可以导致容易地调谐对太赫兹（THz）生物感测潜在有用的传输峰值频率。(C)2010年美国光学学会
We have observed resonant terahertz transmission peaks in samples comprising perforated periodic hole array in a metal film, covered with a high dielectric substrate. These resonant transmissions arise from the interplay between waveguide modes in dielectric substrate and the periodic hole array in the metal film. Finite difference time domain (FDTD) simulations show good agreement with the data, in support of the proposed mechanism. Inducing additional resonant transmissions using guided modes can lead to the ease in tuning the transmission peak frequencies that are potentially useful to terahertz (THz) bio-sensing. (C) 2010 Optical Society of America