Advances in vacuum contamination control for electronic materials processing
Advances in vacuum contamination control for electronic materials processing
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电子材料加工真空污染控制的进展
DOI：
10.1116/1.574921
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发表时间：
1987
期刊：
影响因子：
--
通讯作者：
J. O’Hanlon
中科院分区：
文献类型：
--
作者：
J. O’Hanlon
对具有改进的性能和产量并且以降低的加工成本制造的器件的需求正在推动电子材料加工的进步。最重要的考虑因素是减少加工过程中颗粒污染造成的缺陷。由于器件加工中的许多步骤都使用真空设备，因此它们的要求正在塑造新工具的设计。在本文中，我们描述了加工过程中的污染源，用于减少污染的技术，并注意到与使用新的加工技术有关的真空问题。
The demand for devices with improved performance and yield and fabricated with reduced processing costs is driving advances in electronic materials processing. A most important consideration is the reduction of defects resulting from particulate contamination during processing. Since many of the steps in device processing use vacuum equipment, their requirements are shaping the design of new tools. In this paper we describe the sources of contamination during processing, the techniques used for their reduction, and note vacuum issues that relate to the use of new processing technologies.