Electromagnetic interference shielding effectiveness of ABS carbon-based composites manufactured via fused deposition modelling
Electromagnetic interference shielding effectiveness of ABS carbon-based composites manufactured via fused deposition modelling
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DOI：
10.1016/j.mtcomm.2018.02.034
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发表时间：
2018-06-01
影响因子：
3.8
通讯作者：
Pegoretti, A.
中科院分区：
文献类型：
--
作者：
Schmitz, D. P.;Ecco, L. G.;Pegoretti, A.
采用熔融沉积建模（FDM）技术制备了基于丙烯腈-丁二烯-苯乙烯（ABS）的3d打印样品，该样品装载了多壁碳纳米管（CNT）、炭黑（CB）和50:50混合组合（CNT/CB）。对所得FDM样品的电磁干扰屏蔽效率（EMI SE）进行了评估。采用内混频器将不同量的碳纳米管、碳炭黑和碳纳米管/碳炭黑分散在ABS基体中。根据其流变性能，选择3%的质量分数生产长丝。使用双螺杆挤出机制备长丝，并沿三个不同的生长方向馈送商用FDM机器用于3d打印样品的制备。测量了挤出长丝的电导率、电磁干扰系数和力学性能，以及3d打印样品，并根据填料类型和生长方向对其进行了讨论。总体而言，3D打印部件的电导率、EMI SE和力学性能与生长方向有明显的关系。通过这项工作的实验结果，适当选择聚合物纳米复合材料配方以及3d打印参数可以通过FDM制造具有优化EMI SE和机械性能的组件。
3-D printed samples based on acrylonitrile-butadiene-styrene (ABS) loaded with multi-walled carbon nanotubes (CNT), carbon black (CB) and a 50:50 hybrid combination (CNT/CB) were manufactured via fused deposition modelling (FDM). The electromagnetic interference shielding efficiency (EMI SE) of resulting FDM specimens was assessed. Different amounts of CNT, CB and CNT/CB were dispersed in an ABS matrix by melt compounding using an internal mixer. On the basis of the rheological behavior a weight fraction of 3% was selected for the filaments production. The filaments were prepared using a twin-screw extruder and used to feed a commercial FDM machine for 3-D printed specimen's preparation along three different growing directions. The electrical conductivity, the EMI SE and the mechanical properties of the resulting extruded filaments, as well as the 3-D printed specimens, were measured and, they are discussed in terms of the type of filler and growing directions. In general, the conductivity, EMI SE and mechanical properties of 3D printed parts were markedly dependent on the growing direction. Through the experimental findings of this work, an appropriate choice of a polymer nanocomposite formulation alongside the 3-D printing parameters could lead to components manufactured via FDM with optimized EMI SE and mechanical properties.