Electromechanical Reliability Testing of Flexible Hybrid Electronics Incorporating FleX Silicon-On-Polymer Ics
Electromechanical Reliability Testing of Flexible Hybrid Electronics Incorporating FleX Silicon-On-Polymer Ics
复制标题
采用 FleX 聚合物硅集成电路的柔性混合电子设备的机电可靠性测试
DOI：
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发表时间：
2016
期刊：
影响因子：
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通讯作者：
D. Hackler
中科院分区：
文献类型：
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作者：
Darrell E. Leber;Brian N. Meek;Seth D. Leija;Dale G. Wilson;Richard L. Chaney;D. Hackler
柔性混合电子联合收割机结合了印刷电子和硅IC的最佳特性，创造出高性能、超薄、物理柔性的系统。正在开发新的静态和动态测试，以评估这些系统的性能。动态曲率半径和扭转测试结果的灵活的混合电子系统与FlexX硅聚合物运算放大器在180 nm CMOS工艺与4级金属互连安装在PET基板上制造。
Flexible Hybrid Electronics combine the best characteristics of printed electronics and silicon ICs to create high performance, ultra-thin, physically flexible systems. New static and dynamic tests are being developed to evaluate the performance of these systems. Dynamic radius of curvature and torsional test results are presented for a flexible hybrid electronics system with a FleX Silicon-on-Polymer operational amplifier manufactured in an 180nm CMOS process with 4-levels of metal interconnect mounted on a PET substrate.