L10 ordering and microstructure of FePt thin films with Cu, Ag, and Au additive
L10 ordering and microstructure of FePt thin films with Cu, Ag, and Au additive
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DOI：
10.1063/1.1516870
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发表时间：
2002-11-15
影响因子：
3.2
通讯作者：
Laughlin, DE
中科院分区：
文献类型：
--
作者：
Platt, CL;Wierman, KW;Laughlin, DE
研究了Cu、Ag和Au添加剂对FePt薄膜的L1（0）有序性、织构和晶粒尺寸的影响。晶格参数数据表明，Au和Ag添加剂倾向于从FePt中分离，但Cu与FePt合金化。具有Au或Ag添加剂的FePt膜在450 ℃和更高温度下退火10分钟后显示出比纯FePt膜高1-2 kOe的平均矫顽力值。向FePt中添加至少20体积%的Cu提高了平均矫顽力值并增加了（001）/（002）X射线峰强度比，这表明退火温度超过350 ℃时L1（0）有序化过程加速。薄膜厚度的减小促进了FePt+20% Cu薄膜的（001）织构，但要获得较大的矫顽力，需要较高的退火温度。与纯FePt膜相比，Au和Ag限制了平均晶粒尺寸。Cu的添加增加了薄膜的平均晶粒尺寸和粗糙度。(C)2002年美国物理学会。
The influence of Cu, Ag, and Au additives on the L1(0) ordering, texture, and grain size of FePt thin films has been examined. Lattice parameter data indicated that Au and Ag additives tended to segregate from FePt, but Cu alloyed with FePt. FePt films with Au or Ag additive showed 1-2 kOe higher coercivity values compared to a pure FePt film after annealing at 450 degreesC and above for 10 min. The addition of at least 20 vol. % Cu to FePt boosted average coercivity values and increased (001)/(002) x-ray peak intensity ratios, suggesting an accelerated L1(0) ordering process for annealing temperatures exceeding 350 degreesC. Decreasing the film thickness promoted (001) film texture in FePt+20% Cu films, but higher annealing temperatures were required to achieve large coercivity. Au and Ag limited the average grain size compared to a pure FePt film. Cu additive increased the average grain size and film roughness. (C) 2002 American Institute of Physics.