Importance of shallow hydrogenic dopants and material purity of ultra-wide bandgap semiconductors for vertical power electron devices
Importance of shallow hydrogenic dopants and material purity of ultra-wide bandgap semiconductors for vertical power electron devices
复制标题
浅氢掺杂剂和超宽带隙半导体材料纯度对垂直电力电子器件的重要性
DOI:
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发表时间:
2020
影响因子:
1.9
通讯作者:
J. Speck
中科院分区:
文献类型:
--
作者:
Yuewei Zhang;J. Speck
Ultra-wide bandgap (UWBG) semiconductors are attracting increasing research interest for power device applications. While promising results have been reported for various materials, it remains unclear which material and technology will succeed. Many figure of merits (FOMs) were derived for power device applications to guide material choices, including the widely used Baliga’s FOM (BFOM) to describe the resistive loss of power devices, and Baliga’s high-frequency FOM (BHFFOM) to further consider the switching loss. However, key underlying assumptions for those widely cited FOMs, including the assumption of shallow hydrogenic dopants, tend to fail for UWBG semiconductors. In this work, we revisit several important FOMs in describing vertical power electronics to properly account for both incomplete ionization and background compensation effects. We suggest that it is necessary to include the dopant ionization term (for example n/Nd in an n-drift layer) for both BFOM and BHFFOM to fully capture the potential of the UWBG semiconductors for power device applications. Incomplete dopant ionization in materials like diamond and AlN substantially lowers their FOMs for power switching, leading to high conductive and switching losses. Due to the availability of shallow donors, low background impurity compensation, and bulk substrates, β-Ga2O3 promises the best performance among the investigated materials. The modified FOMs offer a valuable guidance in material choices for power device applications.