Bottom-up assembly of large-area nanowire resonator arrays
Bottom-up assembly of large-area nanowire resonator arrays
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DOI：
10.1038/nnano.2008.26
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发表时间：
2008-02-01
影响因子：
38.3
通讯作者：
Mayer, Theresa S.
中科院分区：
文献类型：
--
作者：
Li, Mingwei;Bhiladvala, Rustom B.;Mayer, Theresa S.
基于纳米线的器件的定向组装将有助于开发具有远远超出主流数字逻辑的新功能的集成电路。例如，纳米机电谐振器对于基于芯片的传感器阵列非常有吸引力，因为它们具有超灵敏质量检测的潜力(3-6)。在这封信中，我们介绍了一种新的自下而上的组装方法来制造大面积纳米机电阵列，每个阵列具有 2,000 多个单纳米线谐振器。纳米线在被集成到硅芯片的预定位置之前经过合成和化学功能化。在组装之前附着到纳米线上的肽核酸探针分子保持其结合选择性，并在谐振器阵列组装完成后识别互补的寡核苷酸靶标。我们使用硅和铑纳米线集成的两种悬臂谐振器在真空中的 Q 因子分别接近 4,500 和接近 1,150。总而言之，这些结果表明，自下而上的纳米线组装可以为基于芯片的敏感检测提供自上而下制造的实用替代方案。
Directed-assembly of nanowire-based devices' will enable the development of integrated circuits with new functions that extend well beyond mainstream digital logic. For example, nanoelectromechanical resonators are very attractive for chip-based sensor arrays' because of their potential for ultrasensitive mass detection(3-6). In this letter, we introduce a new bottom-up assembly method to fabricate large-area nanoelectromechanical arrays each having over 2,000 single-nanowire resonators. The nanowires are synthesized and chemically functionalized before they are integrated onto a silicon chip at predetermined locations. Peptide nucleic acid probe molecules attached to the nanowires before assembly maintain their binding selectivity and recognize complementary oligonucleotide targets once the resonator array is assembled. The two types of cantilevered resonators we integrated here using silicon and rhodium nanowires had Q-factors of similar to 4,500 and similar to 1,150, respectively, in vacuum. Taken together, these results show that bottom-up nanowire assembly can offer a practical alternative to top-down fabrication for sensitive chip-based detection.