Recent advances in C-Si bond activation via a direct transition metal insertion
Recent advances in C-Si bond activation via a direct transition metal insertion
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通过直接过渡金属插入激活 C–Si 键的最新进展
DOI：
10.1016/j.tetlet.2015.01.184
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发表时间：
2015-03-18
影响因子：
1.8
通讯作者：
Song, Zhenlei
中科院分区：
文献类型：
--
作者：
Li, Linjie;Zhang, Yuebao;Song, Zhenlei
通过直接插入过渡金属来活化C-Si键最近在有机化学界获得了越来越多的关注。该方法不仅显示了一个新的和独特的进入功能化的C-Si键，但也提出了一个强大的方法来合成不同的有机硅烷通过形成一个新的C-Si键。本文摘旨在突出一些优雅的进展，这些进展分为应变硅杂环，无环C（sp（3））-Si，无环C（sp（2））-Si和C（sp）-Si键活化。(C)2015由Elsevier Ltd.出版
The C-Si bond activation via a direct transition metal insertion has recently gained growing attention in the organic chemical community. The process not only shows a new and unique entry to functionalize the C-Si bond, but also presents a powerful method to synthesize diverse organosilanes via formation of a new C-Si bond. This Digest is intended to highlight some elegant advances, which are categorized into strained silacycles, acyclic C(sp(3))-Si, acyclic C(sp(2))-Si, and C(sp)-Si bond activation. (C) 2015 Published by Elsevier Ltd.