KF addition to Cu2SnS3 thin films prepared by sulfurization process

KF addition to Cu2SnS3 thin films prepared by sulfurization process
复制标题

DOI:
10.7567/jjap.56.04cs02
复制
发表时间:
2016-07
影响因子:
1.5
通讯作者:
M. Nakashima;J. Fujimoto;T. Yamaguchi;J. Sasano;M. Izaki
M. Nakashima;J. Fujimoto;T. Yamaguchi;J. Sasano;M. Izaki
中科院分区:
物理与天体物理4区
文献类型:
--
作者:
M. Nakashima;J. Fujimoto;T. Yamaguchi;J. Sasano;M. Izaki

文献摘要

被引文献

相似文献

采用氟化硫硫化法制备了Cu 2SnS 3薄膜,并将其应用于光伏器件。采用了两段退火和四层前驱体两种方法,并改变了NaF和KF的用量以及退火温度。通过电子探针显微分析(EPMA),发现Cu/Sn摩尔比的范围为0.81至1.51。X射线衍射(XRD)和拉曼光谱分析表明,制备的薄膜具有单斜Cu 2SnS 3结构。通过两阶段退火制备的Cu 2SnS 3薄膜具有紧密堆积的结构和无针孔的表面形貌。这项研究中最好的太阳能电池显示Voc为293 mV,超过了之前报道的值。
Cu2SnS3 thin films were fabricated by sulfurization with KF addition and applied to photovoltaic devices. Two methods, two-stage annealing and the use of four-layer precursors, were employed, and the quantity of NaF and KF and the annealing temperature were changed. By electron probe microanalysis (EPMA), the Cu/Sn mole ratio was found to range from 0.81 to 1.51. The X-ray diffraction (XRD) patterns and Raman spectra indicated that the fabricated thin films had a monoclinic Cu2SnS3 structure. The Cu2SnS3 thin films fabricated by two-stage annealing had a close-packed structure and a pinhole-free surface morphology. The best solar cell in this study showed Voc of 293 mV, which surpassed the previously reported value.