MD Simulation of Ultra-Micro Cutting of Monocrystalline Silicon with Effects of Air
MD Simulation of Ultra-Micro Cutting of Monocrystalline Silicon with Effects of Air
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DOI：
10.1299/jsmec.49.70
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发表时间：
2006-03
期刊：
影响因子：
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通讯作者：
Yanjie Liu;T. Inamura;N. Takezawa
中科院分区：
文献类型：
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作者：
Yanjie Liu;T. Inamura;N. Takezawa
通过MD（分子动力学）模拟分析了超微切削中气氛的影响，当金刚石刀具和硅工件暴露在大气中时，其表面原子的电势会发生变化。模拟结果表明，如果切削过程中刀具的前刀面和/或切屑的背面暴露在大气中，则主切削力会减小。这一结果与作者进行的微切削实验结果一致，也表明了气氛在超声振动切削中的重要作用。
Effect of atmosphere in ultra-micro cutting has been analyzed using MD (molecular dynamics) simulation carried out in such a way that potentials of surface atoms of diamond tool and silicon workpiece are modified when either of them is exposed to atmosphere. The results of the simulation show that principal cutting force decreases if the rake face of a tool and/or the rear face of chips are exposed to atmosphere during cutting. This result is consistent with the result obtained in microcutting experiments carried out by the authors and also indicates an important role of atmosphere in ultra-sonic vibration cutting.