Miniaturization, Triple-Line Effects, and Reactive Wetting of Microsolder Interfaces.
Miniaturization, Triple-Line Effects, and Reactive Wetting of Microsolder Interfaces.
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DOI：
10.1021/acsami.9b22512
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发表时间：
2020-02
影响因子：
9.5
通讯作者：
Samuel J Griffiths;Patcharawee Jantimapornkij;G. Schmitz
中科院分区：
文献类型：
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作者：
Samuel J Griffiths;Patcharawee Jantimapornkij;G. Schmitz
虽然反应性微焊点在现代电子中具有普遍的重要性，但接头小型化对润湿行为的影响在很大程度上仍未被探索。我们通过研究共晶SnPb焊料在不同宽度的Cu和ni电沉积金属化带上的润湿性来阐明可扩展性的基本问题。接触角与金属化宽度有关，金属化宽度从3mm到~ 100 μm不等。测量角度随金属化宽度的减小而明显增大。根据测量结果，通过修正Young’s方程，可以定量地理解Cu上SnPb的润湿角行为，其“有效”三线能为ϵt =（753±31）× 10-9J/m。讨论了该能量项的解释与形成的金属间相和随之而来的表面粗糙度的关系。实验观察到的尺寸依赖性与Huh和Mason的交叉槽微扰模型之间的显著相似性表明，粗糙的金属间相引起润湿滞后，因此它可以用有效的三线能量来定量地描述。
While reactive microsolder joints are of ubiquitous importance in modern electronics, the effects of joint miniaturization on wetting behavior remain largely unexplored. We elucidate this fundamental question of scalability by investigating the wettability of eutectic SnPb solder on Cu and Ni-electrodeposited metallization strips of varying widths. Contact angles are presented in dependence of the metallization width which is varied from 3 mm down to ∼100 μm. The measured angles clearly increase with decreasing metallization width. Based on the measurements and by modifying Young's equation, it is shown that the behavior of the wetting angle can be quantitatively understood with an "effective" triple-line energy of ϵt = (753 ± 31) × 10-9J/m for SnPb on Cu. The interpretation of this energy term is discussed in relation to the forming intermetallic phase and the ensuing surface roughness. A remarkable similarity between the experimentally observed size dependence and the crossed-groove perturbation model of Huh and Mason demonstrates that the rough intermetallic phase induces wetting hysteresis such that it is quantitatively well described by an effective triple-line energy.