Experimental Study of the High Temperature Mechanical Behaviors of TLP Bonding of Two Ni-Base Single Crystals
Experimental Study of the High Temperature Mechanical Behaviors of TLP Bonding of Two Ni-Base Single Crystals
复制标题
两种镍基单晶TLP键合高温力学行为的实验研究
DOI：
10.4028/www.scientific.net/kem.297-300.1489
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发表时间：
2005
期刊：
影响因子：
--
通讯作者：
Z. Yue
中科院分区：
文献类型：
--
作者：
T. Li;Qing Yuan Wang;Aiqin Wang;Z. Wen;Z. Yue
本文介绍了用TLP键合制备的ni基单晶接头的力学行为。在850℃的温度下，对TLP单晶进行了静态单轴拉伸、蠕变和三点弯曲（T-P-B）加载条件下的实验研究。在相同的加载条件下，对未粘结的ni基单晶试样进行了测试。将TLP单晶的力学行为与基材的力学行为进行了比较。结果表明，与拉伸方向垂直的张力腿板试样的静强度为基体强度的63%。蠕变强度和断裂韧性分别是单晶基材的57%和55%以上。试样断口的宏微观形貌表明，试样的断裂方式为脆性断裂。
In this paper, the mechanical behavior of Ni-base single crystals joint created by TLP bonding is presented. Experimental study has been performed on the TLP single crystal under loading conditions of static uniaxial tension, creep and Three-points-bending (T-P-B) at temperature of 850 °C. Specimens made of the base material, Ni-base single crystal specimens without bonding, were also tested under the same loading conditions. The mechanical behaviors of TLP single crystal is compared to the behaviors of base material. It was found that the static strength of the TLP specimens with the boundary normal to the tensile direction was 63% of the strength of the base material. The creep strength and the fracture ductile strength was more than 57% and 55% of that of the single crystal base material, respectively. The macro and micro graphs of fracture surfaces of specimens indicated that the fracture modes of the samples were brittle fracture.