Ultrasonic cavitation treatment for soldering on Zr-based bulk metallic glass
Ultrasonic cavitation treatment for soldering on Zr-based bulk metallic glass
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DOI：
10.1016/j.jmatprotec.2007.12.032
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发表时间：
2008-09
影响因子：
6.3
通讯作者：
S. Tamura;Y. Tsunekawa;M. Okumiya;M. Hatakeyama
中科院分区：
文献类型：
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作者：
S. Tamura;Y. Tsunekawa;M. Okumiya;M. Hatakeyama
研究了528 K下Sn-Cu-Ni钎料在无助焊剂条件下的超声空化作用下钎料与Zr基块体非晶表面的连接行为。当空化气泡在BMG基板表面溃灭时，焊料润湿界面处出现特征物理现象，这迫使焊料润湿BMG表面。空泡在BMG表面的溃灭导致了严重的冲蚀。这种空蚀在从BMG基底表面立即去除钝化膜方面是有效的。超声振动引起的声毛细效应增强了焊料的附着性能。在此基础上，提出了一种超声钎焊方法，并对其连接工艺进行了详细的研究。
The joining behavior of solder on a Zr-based bulk metallic glass (BMG) surface without a soldering flux was studied under controlled ultrasonic cavitation in molten Sn–Cu–Ni solder at 528K (open to air). Characteristic physical phenomenon appeared at the solder wetting interface when cavitation bubbles collapsed on the surface of the BMG substrate; this forced the wetting of the BMG surface with solder. The collapsing of the cavitation bubbles on the BMG surface-induced severe erosion. This cavitation erosion is effective in the immediate removal of passive film from the BMG substrate surface. The sono-capillary effect that is also induced by the ultrasonic vibration enhanced the adhesion property of the solder. Based on these results, an ultrasonic soldering method is proposed and its joining process is also investigated in detail.