Thermo-viscoelastic Analysis of Thermal Residual Stress and Warp Deformation Influenced by Material Properties in Plastic Laminated Beams
Thermo-viscoelastic Analysis of Thermal Residual Stress and Warp Deformation Influenced by Material Properties in Plastic Laminated Beams
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塑料层合梁材料性能影响的热残余应力和翘曲变形的热粘弹性分析
DOI：
10.4325/seikeikakou.15.302
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发表时间：
2003
期刊：
影响因子：
--
通讯作者：
Yoshiyuki Kushizaki
中科院分区：
文献类型：
--
作者：
Shozo Nakamura;Masahiko Goto;Yoshiyuki Kushizaki
采用基于线性粘弹性理论的热粘弹性基本方程，对塑料复合材料的基本结构--大规模集成电路（LSI）芯片和胶粘剂构成的层合梁的热残余应力和翘曲变形进行了理论计算，得到了如下结果：（1）在LSI芯片中产生芯片表面处的拉伸残余应力和接触区域周围的压缩残余应力，同时在粘合剂材料中产生拉伸残余应力。(2)为了减少界面热残余应力和翘曲变形，需要粘合剂材料的以下性质：（i）高玻璃化转变温度（ii）低热膨胀系数（iii）低松弛模量
Thermal residual stresses and warp deformation of laminated beams constructed from a LSI chip and adhesive, which is the basic structure for plastic composites, were theoretically calculated by using thermo-viscoelastic fundamental equations based on linear-viscoelasticity theory.The results obtained are as follows;(1) Tensile residual stresses at the surface of the chip and compressive residual stresses around the contact area are generated in a LSI chip, while tensile residual stresses are generated in the adhesive material.(2) In order to reduce the interfacial thermal residual stress and warp deformation, the following properties of adhesive materials are desirable;(i) high glass transition temperature(ii) low thermal expansion coefficient(iii) low relaxation modulus