The applications of Cu substrate in liquid metal cooling systems
The applications of Cu substrate in liquid metal cooling systems
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DOI：
10.1016/j.matlet.2018.05.053
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发表时间：
2018-09-15
影响因子：
3
通讯作者：
Berent, Katarzyna
中科院分区：
文献类型：
--
作者：
Gancarz, Tomasz;Berent, Katarzyna
电子和核能的进步导致设备产生更多热量，因此需要更高效的冷却系统。所提出的基于共晶 Ga-Sn-Zn 的液态金属满足了这样的期望。然而，首先应该检查用于存储且主要应用于电子产品的材料，例如铜。将所研究的液体/铜基板对进行横截面并进行扫描电子显微镜观察界面微观结构的变化。通过 X 射线衍射分析鉴定了液体/Cu 基底界面处产生的金属间 Cu-Ga 相层，并确定了 IMC 层形成和生长的动力学。 (C) 2018 Elsevier B.V. 保留所有权利。
Advances in electronics and nuclear energy have led to devices producing greater heat and therefore requiring more efficient cooling systems. The proposed liquid metal based on eutectic Ga-Sn-Zn meets such expectations. First, however, the materials which are used for storage and mostly applied in electronics, such as Cu, should be examined. The investigated liquid/Cu substrate couples were crosssectioned and subjected to scanning electron microscopy to observe interfacial microstructure changes. The created intermetallic Cu-Ga phase layer at the liquid/Cu substrate interface was identified by x-ray diffraction analysis, and the kinetics of the formation and growth of the IMC layer were determined. (C) 2018 Elsevier B.V. All rights reserved.