SoftMod: A Soft Modular Plug-and-Play Kit for Prototyping Electronic Systems

SoftMod: A Soft Modular Plug-and-Play Kit for Prototyping Electronic Systems
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SoftMod:用于电子系统原型设计的软模块化即插即用套件

DOI:
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发表时间:
2020
期刊:
International Conference on Tangible, Embedded, and Embodied Interaction
影响因子:
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通讯作者:
Raf Ramakers
Raf Ramakers
中科院分区:
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文献类型:
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作者:
M. Lambrichts;Jose Maria Tijerina;Raf Ramakers

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我们提出SoftMod,一种新颖的模块化电子套件,由柔软和灵活的模块组成。与现有的模块化套件不同,SoftMod跟踪互连模块的拓扑结构,并支持基本的即插即用行为以及高级用户指定行为。因此,SoftMod组件的形状不依赖于期望的行为,并且可以实现各种2D和3D电子系统。虽然我们模块的即插即用性质刺激了游戏,但用于指定行为和制作各种柔软和灵活形状的高级功能,在试验新型界面(如可穿戴设备、交互式皮肤和纺织品)时提供了很高的天花板。
We present SoftMod, a novel modular electronics kit consisting of soft and flexible modules that snap together. Unlike existing modular kits, SoftMod tracks the topology of interconnected modules and supports basic plug-and-play behavior as well as advanced user-specified behavior. As such, the shape of a SoftMod assembly does not depend on the desired behavior and various 2D and 3D electronic systems can be realized. While the plug-and-play nature of our modules stimulates play, the advanced features for specifying behavior and for making a variety of soft and flexible shapes, offer a high-ceiling when experimenting with novel types of interfaces, such as wearables, and interactive skin and textiles.