Active Connection Mechanism for Soft Modular Robots
Active Connection Mechanism for Soft Modular Robots
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DOI：
10.1163/156855312x626325
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发表时间：
2012-01-01
影响因子：
2
通讯作者：
Floreano, Dario
中科院分区：
文献类型：
--
作者：
Germann, Juerg;Dommer, Michael;Floreano, Dario
到目前为止，大多数模块化机器人系统由于其硬构建块和刚性连接机构而在增加模块数量时缺乏灵活性。为了提高对环境变化的适应性，模块级别的软度可能是有益的。然而，应对软需要从根本上重新思考模块的构建方式。一个主要的挑战是开发一种连接机制，该机制不限制模块的柔软度，不需要精确对准，并且允许容易分离。在本文中，我们提出了一种基于电粘附的软主动连接机制。该机制使用静电力来连接模块。该方法易于实现，可以集成在广泛的软模块类型。根据我们的实验结果，我们得出结论，该机制是合适的作为一个轻量级模块的连接原则时，在很宽的范围内的柔软性，公差对齐和容易拆卸的效率是理想的。本文的主要贡献是：（一）定性比较不同的软模块化机器人的连接器的原则，（二）集成的电粘附，具有新颖的电极图案设计，到软模块和（iii）的演示和表征的功能软模块样机的性能，包括连接机制。(C)Koninklijke Brill NV，莱顿和日本机器人学会，2012年
To date, most modular robotic systems lack flexibility when increasing the number of modules due to their hard building blocks and rigid connection mechanisms. In order to improve adaptation to environmental changes, softness at the module level might be beneficial. However, coping with softness requires a fundamental rethinking of the way modules are built. A major challenge is to develop a connection mechanism that does not limit the softness of the modules, does not require precise alignment and allows for easy detachment. In this paper, we propose a soft active connection mechanism based on electroadhesion. The mechanism uses electrostatic forces to connect modules. The method is easy to implement and can be integrated in a wide range of soft module types. Based on our experimental results, we conclude that the mechanism is suitable as a connection principle for lightweight modules when efficiency over a wide range of softness, tolerance to alignment and easy detachment are desired. The main contributions of this paper are (i) the qualitative comparison of different connector principles for soft modular robots, (ii) the integration of electroadhesion, featuring a novel electrode pattern design, into soft modules and (iii) the demonstration and characterization of the performance of functional soft module mockups including the connection mechanism. (C) Koninklijke Brill NV, Leiden and The Robotics Society of Japan, 2012