Design of new passive THz devices based on micromachining techniques

Design of new passive THz devices based on micromachining techniques
复制标题

基于微加工技术的新型无源太赫兹器件设计

DOI：
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发表时间：
2004
期刊：
The Fifth International Kharkov Symposium on Physics and Engineering of Microwaves, Millimeter, and Submillimeter Waves (IEEE Cat. No.04EX828)
影响因子：
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通讯作者：
L. Schmidt
L. Schmidt
中科院分区：
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文献类型：
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作者：
S. Biber;J. Schur;A. Hofmann;L. Schmidt

文献摘要

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我们概述了利用微机械加工技术制造太赫兹组件的最新成果。讨论了不同的加工技术在生成具有高深宽比的复杂三维几何图形以及满足THz组件的高机械要求方面的能力。回顾了微机械加工技术应用于新元件设计的示范结果。我们强调了硅基微结构在制造新器件方面的潜力。
We present an overview on the latest results using micromachining techniques for the fabrication of THz-components. Different machining techniques was discussed with respect to their capability to generate complex 3-dimensional geometries with high aspect ratios and to meet the high mechanical requirements for THz-components. Exemplary results for the application of micromachining techniques for the design of new components were reviewed. We emphasizes the potential of silicon based microstructures for the manufacturing of new devices.