Calculation of surface tension and wetting properties of Sn-based solder alloys
Calculation of surface tension and wetting properties of Sn-based solder alloys
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DOI：
10.1016/s1359-6462(98)00417-5
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发表时间：
1999-01
影响因子：
6
通讯作者：
S. Yoon;W. Choi;Hyuck-Mo Lee
中科院分区：
文献类型：
--
作者：
S. Yoon;W. Choi;Hyuck-Mo Lee
Solderability that is dependent upon the wettability of two surfaces being joined is crucial to the efficiency of manufacturing and the reliability of electronic devices. Wettability is generally described by the contact wetting angle,, to the substrate. The relationship between surface tensions of various interfaces and the contact angle is given by the Young-Dupre equation as follows: cos SV SL
